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6ES7155-5AA00-0AC0 Siemens
Original price
$962.50
-
Original price
$1,750.00
Original price
$962.50
$962.50
-
$1,750.00
Current price
$962.50
Trusted By
Product Details
Specifications provided for reference. Verify critical details against official manufacturer documentation before installation.
Product Overview
The 6ES7155-5AA00-0AC0 is a SIMATIC ET 200MP PROFINET IO-device interface module (IM 155-5 PN HF). It acts as the communication gateway between a PROFINET network and ET 200MP electronic I/O modules, supporting up to 12 modules without separate power supply (or up to 30 with additional PS). It features an integrated 2-port Ethernet switch for daisy-chaining and supports features such as MRP, isochronous mode, I&M 0…3, prioritized startup and S2 redundancy. The module supports firmware updates and serves as a base for on-machine or panel-mounted decentralized I/O systems.
Best Suited For
- Decentralized I/O in ET 200MP PROFINET networks
- Applications requiring isochronous (IRT) communication
- Systems needing media redundancy (MRP) and S2 startup
- Firmware-update capable devices in distributed automation
PROFINET switch ports
2-Port RJ45
Maximum I/O modules
12 without PS; 30 with PS
Power dissipation
typ. 4.5 W
PROFINET features
MRP, IRT, I&M 0…3, S2 redundancy
Technical Specifications
I/O & Electrical
Supply voltage (rated)
24 V DC
Permissible voltage range
19.2 V - 28.8 V DC
Reverse-polarity protection
Yes
Short-circuit protection
Yes
Current consumption (rated)
0.2 A at 24 V DC
Current consumption (max)
1.2 A
Inrush current (max)
9 A
I²t
0.04 A²·s
Communication & Power
Ethernet ports
2 × RJ45 (100BASE-TX, full-duplex, autoneg/autocross)
PROFINET device
Yes
Media redundancy protocol
MRP client
Isochronous operation (IRT)
Yes (≥0.25 ms)
I&M data
I&M 0 to I&M 3
Firmware update support
Yes
Infeed power to backplane bus
14 W
Power consumption from backplane
2.3 W
Physical & Environmental
Modules per rack (max)
12 I/O modules without separate PS; up to 30 with PS
Address space per module
256 byte (input/output)
Hot-swap support
Module swapping during operation supported with active backplane bus
Step 7 / TIA integration
Configurable via STEP 7 TIA Portal; GSDML V2.3
